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๐Ÿ“ฐ News12 March 2026ยท2 min readยท

Filtronic Develops Advanced Semiconductor Packaging for UK Defence

Source: govuk-visas
Filtronic Develops Advanced Semiconductor Packaging for UK Defence
UK firm Filtronic, supported by Defence Technology Exploitation Programme (DTEP) funding, has developed cutting-edge plastic packaging technology for high-power semiconductors. The innovation is designed to strengthen the UK's strategic independence in critical defence technology supply chains. The case study was published by the UK government on 12 March 2026.
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